Effect of plating current density and annealing on impurities in electroplated Cu film
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منابع مشابه
Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films
To understand a void formation mechanism in electroplated Cu interconnects used for Si-ULSI (ultra-large scale integrated) devices, microstructures of Cu films which were prepared by the electroplating technique using plating baths with or without organic additives were investigated by transmission electron microscopy (TEM). In the as-deposited samples, a high density of micro-voids were observ...
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