Effect of plating current density and annealing on impurities in electroplated Cu film

نویسندگان

  • Chi-Wen Liu
  • Ying-Lang Wang
  • Ming-Shih Tsai
  • Hsien-Ping Feng
  • Shih-Chieh Chang
چکیده

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Effect of Organic Additives on Formation and Growth Behavior of Micro-Void in Electroplating Copper Films

To understand a void formation mechanism in electroplated Cu interconnects used for Si-ULSI (ultra-large scale integrated) devices, microstructures of Cu films which were prepared by the electroplating technique using plating baths with or without organic additives were investigated by transmission electron microscopy (TEM). In the as-deposited samples, a high density of micro-voids were observ...

متن کامل

Mechanism for Cu void defect on various electroplated film conditions

This study observes that copper (Cu) films deposited by high current densities or in an aged electrolyte easily generate void defects after chemical mechanical polishing (CMP). The (111)/(200) ratio and the impurity amount of an electroplated Cu film are found to have strong correlation with the formation of void defects. Furthermore, pulse-reverse waveform plating following direct current plat...

متن کامل

Stress-induced Migration of Electroplated Copper Thin Film Interconnections Depending on Thermal History

Effect of the change of crystallinity and micro texture of electroplated copper thin films by annealing on the stressinduced migration was investigated experimentally and theoretically. The micro texture of electroplated copper thin films changed drastically as a function of their electroplating conditions and the annealing temperature after the electroplating. The crystallinity of the electrop...

متن کامل

Young’s modulus of electroplated Ni thin film for MEMS applications

The Young’s modulus of an electroplated nickel (Ni) thin film suitable for microelectromechanical applications has been investigated as a function of process variables: the plating temperature and current density. It was found that the Young’s modulus is approximately 205 GPa at plating temperatures less than 60 jC, close to that of bulk Ni, but drastically drops to approximately 100 GPa at 80 ...

متن کامل

EFFECT OF PARTICLES CONCENTRATION AND CURRENT DENSITY ON THE COBALT/HEXAGONAL BORON NITRIDE NANO-COMPOSITE COATINGS PROPERTIES

Metal matrix composite coatings reinforced with nano-particles have attracted scientific and technological interest due to the enhanced properties exhibited by these coatings. Cobalt/hexagonal boron nitride nano-composite coatings were prepared by means of the pulse current electroplating from a chloride electrolyte on copper substrates and a comparison was made with the pure cobalt in terms of...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2014